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2500w Mini Desktop Reflow Oven 270*270mm Air Infrared BGA SMD SMT Rework Station

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  • Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 03 Feb, 2026, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
  • Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
  • Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
  • Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is this product?

The 2500w Mini Desktop Reflow Oven is a compact rework station for soldering mounted PCBs and reworking SMD/BGA components using combined infrared and hot air heating.

2. What are the key specifications?

Rated power: 2500W (peak). Voltage: AC 220V. Current: 11.4A. Overall dimensions: 420 × 405 × 265 mm. Net weight: 20 kg. Package size: 52 × 51 × 38 cm. Gross weight: 25 kg.

3. What size boards can it handle?

Soldering area is 270 × 270 mm. Rated capacity is listed at 300 × 300 mm, so it is best suited for small to medium PCBs, prototyping, and repair work.

4. What heating modes does it use?

The unit uses a combination of infrared radiation and hot air heating to provide even, efficient heat distribution for reflowing solder.

5. Is it suitable for lead-free soldering?

Yes. It is designed for both leaded and lead-free soldering processes.

6. Can I use it for BGA and fine-pitch SMD rework?

Yes. The oven is intended for reworking surface-mount devices including BGA components, offering precise and even heating for delicate packages.

7. How do I operate the oven safely?

Place the PCB centrally on the soldering area, use appropriate temperature/time profiles (follow solder paste and component manufacturer recommendations), ensure good ventilation or fume extraction, and allow the unit to cool before handling. Always follow the user manual and local electrical safety rules.

8. Does the oven come with technical support?

Video technical support is available. For detailed assistance, check the seller’s support channels or included documentation.

9. Is there a warranty or after-sales service?

Specific warranty terms are not listed in the product description. Contact the seller or distributor to confirm warranty length and after-sales service details.

10. What maintenance is required?

Regular maintenance includes keeping the heating elements and chamber free of excess flux and debris, checking airflow paths, and allowing the oven to cool before cleaning. Follow the user manual for recommended maintenance intervals.

11. Do I need special ventilation or fume extraction?

Yes. Reflowing solder can produce fumes. Use the oven in a well-ventilated area and, where possible, employ a fume extractor or local ventilation to protect health and prevent residue buildup.

12. Can this oven be used for production runs?

This is a mini desktop reflow oven designed primarily for prototyping, repair, small batches, and educational use. It is not optimized for high-volume continuous production.

13. What precautions should I take for temperature-sensitive components?

Use recommended reflow profiles for your solder paste and components, minimize exposure time at peak temperatures, consider shielding or selective heating for sensitive parts, and monitor board temperatures with thermocouples when precision is required.

14. Are there limits on PCB thickness or weight?

Specific maximum board thickness and weight are not provided. Given the desktop design and 270 × 270 mm soldering area, the oven is intended for typical PCB assemblies used in prototyping and repair rather than very thick or heavy boards.

15. What should I do if the unit malfunctions?

Stop using the oven, disconnect power, and contact the seller or technical support. Use the provided video technical support resources and consult the user manual for troubleshooting steps.

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