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Compact Plasma Etching Cleaner for Laboratory Optical Glass Wafer Surface Preparation

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  • Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 03 Feb, 2026, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
  • Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
  • Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
  • Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is the primary function of the Compact Plasma Etching Cleaner?

The Compact Plasma Etching Cleaner is designed to clean and etch optical glass wafer surfaces in laboratory settings, ensuring high-quality results for various applications.

2. What is the chamber size of the machine?

The chamber size of the Compact Plasma Etching Cleaner has a diameter of 100 mm and a length of 270 mm.

3. How efficient is the Compact Plasma Etching Cleaner?

The machine has a cleaning efficiency of 75% or higher, making it highly effective for surface preparation.

4. What is the warranty period for the product?

The Compact Plasma Etching Cleaner comes with a 1-year warranty.

5. What type of cooling method does the machine use?

The machine utilizes a forced air cooling system for optimal performance during operation.

6. Can the Compact Plasma Etching Cleaner be customized for specific needs?

Yes, customizable options are available to meet specific requirements for different applications.

7. What are the applications of the Compact Plasma Etching Cleaner?

Applications include preparing optical glass wafers for microscopy, cleaning surfaces in semiconductor manufacturing, and etching metal surfaces on printed circuit boards (PCBs).

8. What is the signal frequency of the Compact Plasma Etching Cleaner?

The signal frequency is 13.56 MHz ±0.005%.

9. Is the machine suitable for research laboratory use?

Yes, the Compact Plasma Etching Cleaner is specifically designed for use in research laboratories for surface treatment.

10. What kind of power stability does the machine provide?

The Compact Plasma Etching Cleaner offers power stability of ±0.1%.

11. What type of RF connector is used with this machine?

The machine is equipped with an N type RF connector.

12. What is the maximum reflected power of the machine?

The maximum reflected power is ≤200W.

13. Is the Compact Plasma Etching Cleaner easy to integrate into existing laboratory setups?

Yes, the compact design allows for easy integration in various laboratory environments.

14. How does the machine enhance adhesion in coating processes?

By effectively cleaning and preparing surfaces, the machine enhances adhesion, which is critical in coating applications.

15. What are the noise levels associated with the operation of the machine?

The harmonic component of the machine is ≤-50 dBc, indicating low noise levels during operation.

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