The primary function of the Semiconductor Packaging Machine is to provide high-density wire bonding for semiconductor packaging, ensuring precision and efficiency in the bonding process.
The Semiconductor Packaging Machine operates at a voltage of 220V and a frequency of 50Hz.
The machine weighs 800 kg, making it a robust and stable option for high-density bonding applications.
Yes, this machine is specifically designed for high-density applications, providing reliable and precise bonding capabilities.
The Semiconductor Packaging Machine comes with a one-year warranty, ensuring peace of mind for your investment.
Absolutely, the machine is suitable for research and development in electronics, providing versatility for various applications.
The single package size of the machine is 150x120x120 cm.
Key features include automatic operation for ease of use, high-density bonding capabilities, deep access design for versatile applications, and robust construction for long-lasting performance.
This machine can be used in semiconductor packaging, microelectronics manufacturing, production lines for electronic components, and testing and prototyping of semiconductor devices.
Yes, the automatic operation of the machine makes it user-friendly and suitable for beginners as well as experienced professionals.
The advanced technology and robust construction of the machine ensure high reliability and precision in bonding processes.
Yes, the machine's deep access design allows it to handle various types of semiconductor devices and applications.
Regular maintenance includes cleaning, checking wiring connections, and ensuring that all components are functioning correctly to maintain optimal performance.
Many suppliers offer training and support for new users to ensure they are comfortable and efficient in operating the machine.
Industries such as electronics manufacturing, semiconductor production, and R&D in microelectronics greatly benefit from using this bonding machine.
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