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IC LED Mashed Ball Thickness Measuring Microscope for Wire Bonder Wire Bonding Machine

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  • Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 13 Feb, 2026, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
  • Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
  • Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
  • Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is the primary function of the IC LED Mashed Ball Thickness Measuring Microscope?

The primary function of the IC LED Mashed Ball Thickness Measuring Microscope is to accurately measure the thickness of wire bonds in wire bonding applications.

2. Is the microscope easy to operate?

Yes, the microscope features an easy-to-use interface with a clear display, making it user-friendly for operators.

3. What materials can I use this microscope on?

This microscope is designed for use in wire bonding applications, particularly in semiconductor manufacturing and electronic assembly.

4. How accurate is the measurement provided by this microscope?

The microscope is built for high precision measurement, ensuring accuracy in wire bond thickness readings.

5. What is the weight of the microscope?

The IC LED Mashed Ball Thickness Measuring Microscope weighs 50 kg.

6. Does the product come with a warranty?

Yes, the microscope comes with a one-year warranty for added peace of mind.

7. Are there any test reports provided with the microscope?

Yes, a comprehensive machinery test report is included with the purchase of the microscope.

8. Can this microscope be used for educational purposes?

Absolutely! It is suitable for educational purposes in engineering programs, offering hands-on experience in measurement techniques.

9. What is included in the package when purchasing the microscope?

The package includes the microscope, a comprehensive machinery test report, and access to video outgoing inspection if applicable.

10. Is the microscope suitable for research and development?

Yes, this microscope is ideal for research and development in material science and related fields.

11. What kind of quality control can be performed with this microscope?

You can perform quality control checks on wire bonds in electronic assembly, ensuring that they meet specified thickness standards.

12. How durable is the construction of the microscope?

The microscope is built with durable construction, ensuring long-lasting use in various wire bonding applications.

13. What industries can benefit from using this microscope?

Industries such as semiconductor manufacturing, electronics assembly, and material science research can greatly benefit from this microscope.

14. What features make this microscope stand out?

Key features include high precision measurement, easy-to-use interface, durable construction, and comprehensive test reports.

15. How does the microscope assist in calibration and testing?

The microscope assists in calibration and testing by providing accurate measurements of wire bond thickness, critical for maintaining production standards.

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